Precision machining for semiconductors and electronics

Semitron Technology machines consumable parts for semiconductor assembly houses, subcontract packaging houses and electronics companies: heat spreaders, stiffeners, graphite jigs and RF heat sinks.

Graphite jig for CBGA packaging (left) and a CBGA substrate with aligned solder balls (right) Graphite jig (DFP-1) CBGA micro solder ball alignment
Founded
April 2025
Factory floor
760 m²Head office and factory in Ansan, Korea
Annual capacity
2,000,000 pcsM type; 20% more for other types
Certification
ISO 9001
ISO 14001

Quality

Every day we check dimensions and appearance of outgoing parts under the microscope, and each shipment comes with a certificate of conformance. We were certified to ISO 9001 and ISO 14001 in January 2026.

Quality control

Facilities

Machining, downset, laser marking and measurement all happen in our 760 m² factory. We run five NC machining centers, two wire cut machines, six downset machines, a 3D measurement system and microscopes.

Equipment list
Capacity by process
ProcessCapacity
High-precision machining center2,000,000 pcs / year
Laser marking2,400,000 pcs / year
Matrix-type downset200,000 frames / month
High-speed machining (SOT115)300,000 pcs / month

Specifications, quotes and samples

Email us your drawings or requirements and we will get back to you.