Heat spreaders, stiffeners
Frame-type heat spreaders and stiffeners for high-end FBGA substrates, replacing conventional drop-in heat spreaders placed one by one. We were the first in the world to develop and supply them.
- Application
- High-end FBGA substrates
- Downset depth
- Up to 0.8 to 1 mm
- Quality
- No warpage, twist, crossbow or coil set. No lid tilt or shift. Controlled overall coplanarity
- Surface finish
- Black oxide, black epoxy top
- Capacity
- Downset 200,000 frames a month
- Downset tools
- 14×14, 15×15 (3×3×4)
19×19, 21×21 (2×2×4)
31×31 (1×1×4)
Key process
- Etching
- Black oxide
- Black epoxy top
- Deep downsetCritical step